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Itoki Group Company Dalton Establishes Subsidiary and Acquires Semiconductor Manufacturing Equipment Business
ITOKI CORPORATION (Head office: Chuo-ku, Tokyo; President and CEO: Koji Minato) has formulated a three-year medium-term management plan, "RISE TO GROWTH 2026," starting in 2024, with seven key strategies.
In the research facility area of Equipment & Public Works-Related Business we aim to expand our market share by introducing new products, and in fiscal 2025, as part of our pursuit of group synergy, we are promoting management reforms at Dalton (head office: Chuo-ku, Tokyo; President and CEO: Tadashi Sawada), a group company whose main business is the research facility area.
In this context, Dalton Corporation (hereinafter, "Dalton") is pleased to announce that it has acquired the semiconductor manufacturing equipment business operated by Asuka Technology Corporation (hereinafter, "Asuka Technology") through its newly established wholly owned subsidiary, AD Technologies Corporation (hereinafter, "AD Technologies"), as detailed below.
1. Overview of the business acquisition
(1) Business to be acquired: Asuka Technology's semiconductor manufacturing equipment business (design, manufacturing, sales, and maintenance)
(2) Acquisition method: Business acquisition by AD Technologies
(3) Acquisition date: September 1, 2025
(4) Management structure after the acquisition: All Asuka Technology employees will transfer to AD Technologies and continue business operations.
2. Reasons for the business acquisition
Dalton has been operating the semiconductor manufacturing equipment business since 1990, and currently handles a wide range of processes, primarily front-end processes, from small-scale production for research and development to mass production equipment, depending on the wafer, tool, and application, including peeling, cleaning, drying, plating, and solvent recycling in semiconductor manufacturing.
Dalton's semiconductor manufacturing equipment business has seen an increase in sales and business negotiations in recent years, but strengthening its supply capacity has become an urgent issue. Asuka Technology has supported Dalton as a major supplier for over 30 years since its founding, and its high level of technical expertise is highly regarded by customers.
AD Technologies, a wholly owned subsidiary of Dalton, will now take over Asuka Technology's business, and by combining Asuka Technology's technological capabilities with the management resources of our group, we aim to strengthen the group's technological capabilities and supply capabilities. Furthermore, by collaborating with the facility equipment business division of our parent ITOKI CORPORATION, we will strengthen our response capabilities in the areas of maintenance and manufacturing, and achieve long-term business growth.
3. Overview of the subsidiary to be established
(1) Name |
AD Technologies, Inc. (English: AD Technologies Co., Ltd.) |
---|---|
(2) Location | 3-9-11 Nagaoka, Mizuho-machi, Nishitama-gun, Tokyo |
(3) Representative's title and name | President and CEO Shinji Sunohara |
(4) Business details | Manufacture, sale and maintenance of semiconductor manufacturing equipment |
(5) Capital | 45 million yen |
(6) Date of establishment | August 8, 2025 |
(7) Investment ratio |
Dalton Co., Ltd. (100%) |
4. Overview of the Counterparty
(1) Name |
Asuka Technology Co., Ltd. |
---|---|
(2) Location | 3-9-11 Nagaoka, Mizuho-machi, Nishitama-gun, Tokyo |
(3) Representative's title and name | Masatsugu Matsushita, President and CEO |
(4) Business details | Manufacture, sale and maintenance of semiconductor manufacturing equipment |
(5) Capital | 45 million yen |
(6) Date of establishment | September 1994 |
(7) Relationship with the Company |
Capital relationship: Not applicable. |
*Some of the semiconductor manufacturing equipment manufactured and sold by our group
Resist stripping equipment (left), etching equipment (right)
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株式会社ダルトン
企画本部
Tel:
03-3549-6855
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ITOKI CORPORATION
Corporate Communications Division
Public Relations Division
TEL:03-6910-3910
- The information posted is current at the time of publication. Please note that the information may differ from the latest information.