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ITOKI CORPORATION (Headquarters: Chuo-ku, Tokyo; President: Tadashi Sawada), a group company of Dalton Corporation (Headquarters: Chuo-ku, Tokyo; President: Koji Minato), will exhibit at SEMICON Japan 2025, an international electronics manufacturing exhibition to be held at Tokyo Big Sight from December 17 (Wed) to 19 (Fri), 2025, covering everything from manufacturing technologies, equipment, and materials in the semiconductor industry to SMART applications such as cars and IoT devices. We will exhibit at SEMICON Japan 2025, an international exhibition for electronics manufacturing, which will be held at Tokyo Big Sight from December 17 (Wed.) to 19 (Fri.), 2025. We will be exhibiting our steam two-fluid cleaning system and ozone water generator, and will offer visitors the opportunity to experience the features of each system through demonstrations and other activities.

Dalton began its semiconductor manufacturing equipment business in 1990, inspired by the idea that its existing draft chamber manufacturing technology could be utilized in the wafer research process. We handle a wide range of processes, primarily front-end processes, from small-scale production for research and development to mass production equipment, depending on the wafer, tool, and application, including peeling, cleaning, drying, plating, and solvent recycling in semiconductor manufacturing.

At this exhibition, we will be showcasing a wide range of equipment that enables chemical-free wafer processing, such as steam two-fluid cleaning equipment, ozone water generators, and FOUP-related equipment, based on the theme of "reducing environmental impact," a recent trend. In addition, we will be showcasing a wide range of equipment, including lift-off/resist stripping equipment and etching equipment, through graphics and videos.

・Steam two-fluid cleaning device
This cleaning equipment removes foreign matter by spraying steam and water at supersonic speeds instead of chemical solutions. The two fluids, steam and water, are sprayed at supersonic speeds, causing countless water droplets to collide with the target object, generating cavitation (vacuum bubbles) in the droplets, and the force of the shock waves generated when the vacuum bubbles collapse is used to remove the foreign matter. It is used for foreign matter removal, post-polishing cleaning, metal lift-off, resist stripping, etc. The cleaning technology of this equipment will also be explained at exhibitor seminars.

・Ozone water generator
This device generates ozone water instead of chemicals and can be used in the cleaning process. It can be used as an option for various cleaning devices. It uses a circulation system, which means that there is very little accumulated water or wasted water, and it features a fast concentration rise (ozone water can be generated in about 1 minute). It generates ozone water suitable for precision cleaning using its unique technology.

・FOUP cleaning equipment (graphic display)
This equipment cleans FOUPs, which are airtight containers used for storing and transporting wafers. Its unique cleaning process makes it possible to clean unwanted materials and particles remaining inside the FOUP. Furthermore, the use of an instantaneous heating system allows for the rapid cleaning of stubborn adhesives and particles, providing high cleaning capabilities. Furthermore, the cleaning solution is pure water only, so the amount used is small, which helps reduce the environmental impact. It is also possible to subject the FOUP box and lid to cleaning and vacuum processes in separate areas.

https://www.semiconjapan.org/jp/about/pricing-and-register

"Next-generation cleaning process: Chemical-free resist removal using two fluids of steam and high-temperature, high-concentration ozone water"
We will explain the three mechanisms of steam-two-fluid cleaning, as well as cleaning applications and treatment results.
Date and time: December 18, 2025 (Thursday) 11:30-12:20
Location: West Hall 2, 2nd floor, Business Meeting Room 2
*Anyone with a visitor badge can participate.