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Dalton to exhibit at SEMICON Japan 2024, Japan's largest international electronics manufacturing exhibition, bringing together semiconductor manufacturing technologies, equipment, and applications
FOUP cleaning equipment and double-sided brush manual spin cleaning equipment will be on display, and operation examples and demonstrations will be given.
ITOKI CORPORATION (Headquarters: Chuo-ku, Tokyo; President: Yoichi Ohdate), a group company of Dalton Corporation (Headquarters: Chuo-ku, Tokyo; President: Koji Minato), will exhibit at SEMICON Japan 2024, an international electronics manufacturing exhibition to be held at Tokyo Big Sight from December 11 (Wed) to 13 (Fri), 2024, covering everything from manufacturing technologies, equipment, and materials in the semiconductor industry to SMART applications in cars and IoT devices. We will exhibit at SEMICON Japan 2024, an international exhibition for electronics manufacturing covering everything from manufacturing technology, equipment, and materials in the semiconductor industry to SMART applications such as cars and IoT devices. The FOUP cleaning system and double-sided brush manual spin cleaning system will be exhibited, and visitors will be able to experience the features of each system through demonstrations and other hands-on activities.
Dalton began its semiconductor manufacturing equipment business in 1990, inspired by the idea of applying its existing fume hood manufacturing technology to the wafer research process. We handle a wide range of processes, primarily front-end processes, from small-scale production for research and development to mass production equipment, depending on the wafer, tool, and application, including peeling, cleaning, drying, plating, and solvent recycling in semiconductor manufacturing.
At this exhibition, we will be exhibiting a FOUP cleaning system manufactured by Taiwan's Semtek Corporation, and a double-sided brush manual spin cleaning system that is mainly used for cleaning after CMP (Chemical Mechanical Polishing). In addition, we will be introducing our wide range of equipment such as lift-off/resist stripping equipment and etching equipment through graphics and videos.
Main exhibit products
・FOUP cleaning equipment
Our unique cleaning process allows us to clean residues and particles. Furthermore, the instantaneous heating system allows us to quickly clean stubborn adhesives and particles, and we have a high cleaning capacity. In addition, we only use pure water as a cleaning liquid, so the amount used is small, which helps reduce the environmental impact. We can also clean and vacuum the FOUP BOX and lid in separate areas. At this exhibition, we will only be exhibiting the vacuum cleaning chamber.
https://www.dalton.co.jp/product/detail/semiconductor/peeling_cleaning/peeling_cleaning/foup
- Double-sided brush manual spin cleaning device
This equipment cleans the front and back surfaces of a wafer with a brush at once. By using it in combination with two-fluid cleaning, it is possible to remove stubborn deposits and fine particles. It is mainly used for cleaning after CMP.
https://www.dalton.co.jp/product/detail/semiconductor/peeling_cleaning/peeling_cleaning/brush
Event and exhibition details
| name | SEMICON Japan 2024 |
|---|---|
| Overview | This is an international exhibition of electronics manufacturing that covers everything from manufacturing technologies, equipment, and materials in the semiconductor industry to smart applications such as cars and IoT devices. It will also be held at the same time as the Advanced Packaging and Chiplet Summit (APCS), which brings together top players in the fields of semiconductor packaging and board mounting. |
| Period | Wednesday, December 11th - Friday, December 13th, 2024 10:00-17:00 |
| place | Tokyo Big Sight East Exhibition Hall 〒135-0063 3-11-1 Ariake, Koto-ku, Tokyo |
| Exhibition URL | https://www.semiconjapan.org/jp |
| booth | East Hall 5 Booth No. 5237 |
[Admission Badge Registration Form]
https://www.semiconjapan.org/jp/about/pricing-and-register
Dalton's semiconductor manufacturing equipment business
Dalton's semiconductor manufacturing equipment is used in wet processes, mainly stripping, cleaning, and drying in the front-end process. In addition, we have a lineup of equipment that can be used in a variety of other processes, such as electrolytic/electroless plating, resist coating, development, and anodization. Each equipment can be manufactured individually, and we can realize custom designs according to wafers and applications, regardless of existing equipment or specifications. We flexibly propose and manufacture the necessary equipment, from small-scale production for research and development to mass production machines, in accordance with our customers' needs.
Dalton's business
The Dalton Group is a long-established Japanese manufacturer founded over 80 years ago that has supported the business development and technological improvement of its customers in the relevant industries for many years, with the slogan "Towards co-creation together with our customers, who are the protagonists of value creation activities." The group operates eight businesses, including research facilities, education facilities, powder machinery, clean equipment, and semiconductor manufacturing equipment, and provides a variety of high-added-value products and services to customers at various specialized facilities such as research and development institutions and manufacturing plants for pharmaceuticals, chemicals, biology, food, and precision machinery, as well as educational institutions and medical institutions.
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Contact information
株式会社ダルトン CS機器事業部
TEL：03-3549-6843
MAIL：info_cs[at]dalton.co.jp
※[at]を@に置き換えて下さい。
press personnel
Contact information
ITOKI CORPORATION
Corporate Communications Division
Public Relations Division
TEL:03-6910-3910
- The information posted is current at the time of publication. Please note that the information may differ from the latest information.